|
|
|
|
|
|
New I/O Modules Simplify Device Connections in Hazardous Areas
4
August
2020
|
|
Industrial producers can more easily and efficiently connect to devices in hazardous areas using the new Allen-Bradley 1718 Ex I/O modules from Rockwell Automation. The intrinsically safe distributed I/O modules provide EtherNet/IP connectivity to field devices in Zone 0 and Zone 1 hazardous areas.
1718 Ex I/O modules can reduce wiring in industrial applications because they can be mounted in Zone 1, closer to field devices in hazardous areas. The I/O modules can also save space with a compact, chassis-based I/O design that contains the primary power supply and an optional redundant power supply in the chassis.
Different chassis options and slot sizes allow users to scale the 1718 Ex I/O modules to meet a wide range of system requirements. Add-on Profiles in the Studio 5000 Logix Designer application help ease configuration of the modules. And a dual-port EtherNet/IP adapter that enables a Device Level Ring (DLR) topology can help improve network resilience.
The 1718 Ex I/O modules are designed for hazardous applications found in industries like chemical, oil and gas, and food and beverage. An ATEX-certified enclosure is required for the 1718 Ex I/O modules to be mounted in an ATEX Zone 1 area. As a complete solution, Rockwell Automation collaborates with our Encompass partner Pepperl+Fuchs, who offers Zone 1 certified enclosures.
The Allen-Bradley intrinsically safe distributed I/O portfolio also includes the 1719 Ex I/O product family, which is certified for mounting in Class I, Division 2 (North America) and Zone 2 (global) hazardous areas.
For more information, please contact:
Elena Gardiner Rockwell Automation Ltd Tel: +44 1908 627889 Email: EPopova@ra.rockwell.com Web: www.rockwellautomation.co.uk |
|
|
|
FactoryEquipment.com are not responsible for the content of submitted or externally produced articles and images.
Click
here to email FactoryEquipment.com about any errors or omissions contained within this article. |
|
|
|
|
|
|
|